In-Depth Analysis: VoIP Chips: Preparing for a Wireless Multimedia Future
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VoIP is moving toward the edge and nowhere is this more apparent than within the silicon required to convert voice into IP packets. While today, less than 16% of total VoIP chip revenues are attributed to IP phones, this submarket segment will represent close to 60% of total sales by 2010.
Tomorrow’s IP phones and the chips used to produce them will clearly be very different from today’s business-oriented sets. This report addresses the often complex interplay between end users, carriers, equipment manufacturers, and VoIP chip producers, an understanding of which is crucial to anyone needing a full appreciation of the ripple effect throughout the value chain associated with enabling a wireless, multimedia future.
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802.11n: Great Wireless LAN Expectations
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Great expectations certainly abound for the next step in wireless LAN technology, the much-hyped IEEE 802.11n. People have dreamed about the kind of raw speed it is promising, up to 600Mbps, virtually unheard of for a wireless technology of any kind. 802.11n will be to 802.11b what a Maserati is to a Pinto.
In-Stat expects the break-out year for 802.11n will be 2008. By mid-2008, the standard should be formally ratified and the first stage of Wi-Fi certified products should be rolling out, with many of the early product bugs worked out of chipsets and end-products, and vendors working on cost and power-efficiency instead of just frantically racing to put out products. During 2008, we expect that the majority of chipsets shipped out, a little over 50%, will be based on 802.11n, representing 195 million 802.11n chipsets shipments for 2008.
In-Stat expects that breakout years, where 50% or more of the total WLAN chipsets will be 802.11n, will differ by segment:
-Embedded WLAN in Mobile PCs–2008
-Enterprise APs–2008
-Home/SOHO Wireless Routers, Gateways, Standalone APs–2008
-External Clients–2008
-Dual-mode Cellular/Wi-Fi Phones–2009
-Stationary CE Devices–2009
-Portable CE Devices–2010
-Consumer Wi-Fi-Only Phones–beyond 2010
-Business Wi-Fi-Only Phones–beyond 2010
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DSL IC Chipsets: The Emergence of VDSL2
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This report analyzes the market for DSL physical layer ICs, focusing on ADSL (including ADSL2 and ADSL2+), VDSL, and SHDSL. Key technology and market trends are discussed, such as the development of ADSL2+, the shift to VDSL2, and the driving force of IPTV. In addition, the overall structure of the industry is analyzed, and the YE 2005 and 1Q06 ADSL IC, VDSL IC, and SHDSL IC port shipments and market shares are provided for all of the vendors active in the market. Five-year forecasts, from 2005–2010, are provided for ADSL, VDSL, and SHDSL for both CO and CPE ports and include port shipments, ASPs, and revenues. This report will be particularly useful to product managers in DSL IC vendor companies, financial analysts covering the DSL IC market, and consultants advising clients in the DSL IC market.
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A Comprehensive Comparison of Major AdvancedTCA Platforms Versus IBM’s BladeCenter T
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This report provides a comprehensive comparison between four major AdvancedTCA platform providers. IBM’s BladeCenter series-T is included for comparison purposes. The AdvancedTCA platform providers include Hewlett Packard, Motorola, Radisys, and Sun Microsystems.
Discussions with the identified platform providers included a review of market strategies with a principal focus on customer platform offerings, applications, Networking Equipment Building Standards (NEBS) compliance, major products targeted, major platform wins, geographical areas focused on, and pricing.
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